电子科学与技术专业英语——微电子技术分册
￥22.00定价
作者： 陈伟平、田丽
出版时间：2007年9月
出版社：哈尔滨工业大学出版社
- 哈尔滨工业大学出版社
- 9787560318332
- 372748
- 2007年9月
内容简介
本书由半导体物理、半导体器件、半导体与集成电路工艺、集成电路设 计、微电子机械系统和科技文献范例六部分组成。全书涵盖了微电子技术领 域的基本内容，同时又介绍了该领域的一些较新的发展。
本书可作为电子科学与技术专业微电子技术方向的三、四年级本科生的 专业英语教材，也可供相关专业的本科生和从事该专业领域的工程技术人员 使用。
本书可作为电子科学与技术专业微电子技术方向的三、四年级本科生的 专业英语教材，也可供相关专业的本科生和从事该专业领域的工程技术人员 使用。
目录
Chapter 1 Semiconductors Physics
1．1 Energy Bands and Carrier Concentration
1．2 Carrier Transport Phenomena
1．3 PN Junction
1．4 Summary
参考文献
Chapter 2 Semiconductor Device
2．1 Bipolar Junction Transistor
2．2 The MOSFET
2．3 Microwave and Photonic Devices
2．4 Stamary
参考文献
Chapter 3 Processing Technology
3．1 Crystal Growth and Epitaxy
3．2 Crystal Growth from the Melt
3．3 Vapor-Phase Epitaxy
3．4 Oxidation and Film Deposition
3．5 Diffusion and Ion Implantation
3．6 Lithographies
3．7 Wet Chemical Etching
3．8 Dry Etching
3．9 Integrated Devices
3．10 Fundamental Limits of Integrated Devices
参考文献
Chapter 4 Integrated Circuits
4．1 Introduction
4．2 Design Analysis and Simulation
4．3 Vedficafion
4．4 Summary
参考文献
Chapter 5 Microelectromechanical Systems(MEM)
5．1 Introduction
5．2 MEMS
5．3 Mechanical Characteristics of Silicon
5．4 Microfabrications for MEMS
5．5 Micmsensing for MEMS
5．6 Electromechanical Actuation
5．7 Materials for MEMS
参考文献
Chapter 6 Examples of Scientific and Technological Papers
6．1 The Challenges for Physical Limitations in si Microelectronics
6．2 Micmelectronics and Photonics—the Future
6．3 Accelerated Verification of Digital Devices Using VHDL
6．4 What Is Nanotechnology
参考文献
1．1 Energy Bands and Carrier Concentration
1．2 Carrier Transport Phenomena
1．3 PN Junction
1．4 Summary
参考文献
Chapter 2 Semiconductor Device
2．1 Bipolar Junction Transistor
2．2 The MOSFET
2．3 Microwave and Photonic Devices
2．4 Stamary
参考文献
Chapter 3 Processing Technology
3．1 Crystal Growth and Epitaxy
3．2 Crystal Growth from the Melt
3．3 Vapor-Phase Epitaxy
3．4 Oxidation and Film Deposition
3．5 Diffusion and Ion Implantation
3．6 Lithographies
3．7 Wet Chemical Etching
3．8 Dry Etching
3．9 Integrated Devices
3．10 Fundamental Limits of Integrated Devices
参考文献
Chapter 4 Integrated Circuits
4．1 Introduction
4．2 Design Analysis and Simulation
4．3 Vedficafion
4．4 Summary
参考文献
Chapter 5 Microelectromechanical Systems(MEM)
5．1 Introduction
5．2 MEMS
5．3 Mechanical Characteristics of Silicon
5．4 Microfabrications for MEMS
5．5 Micmsensing for MEMS
5．6 Electromechanical Actuation
5．7 Materials for MEMS
参考文献
Chapter 6 Examples of Scientific and Technological Papers
6．1 The Challenges for Physical Limitations in si Microelectronics
6．2 Micmelectronics and Photonics—the Future
6．3 Accelerated Verification of Digital Devices Using VHDL
6．4 What Is Nanotechnology
参考文献
